How to utilize natural cooling in micro-modules
Experimental Investigation of Active Microfluidic Cooling Solution
The aim of the present investigation was to test the microchannel heat sink with Z-type flow configuration, using nanofluid as a promising solution to chip cooling technology.
Optimizing microelectronic module cooling under magnetic
In this study, an advanced cooling method for microelectronic modules in a magnetic field is examined through a numerical and artificial intelligence approach. The research utilized a
xMEMS | Micro Cooling | Edge AI Devices & AI Data Centers
xMEMS'' micro cooling fan-on-a-chip, a 1mm-thin, solid-state active thermal management solution for next-gen edge AI hardware and AI data center systems.
Microfluidic Cooling: Microfluidics Explained
Microfluidic cooling allows efficient heat dissipation in electronic devices. By circulating coolant through microscale channels embedded in the device, heat is absorbed and the heated coolant is then
Jet-enhanced manifold microchannels for cooling electronics up to a
In this Article, we report an embedded microfluidic cooling strategy that is capable of dissipating heat fluxes up to 3,000 W cm −2 at a pumping power of only 0.9 W cm −2 using single
Energy-efficient cooling of silicon-based microfluidic chips enabled by
In this work, we present silicon-based microfluidics chips with integrated microstructural and surface modification strategies to reveal the coupling mechanism and enable energy-efficient
Design and Fabrication of Embedded Microchannel Cooling
This manuscript presents and implements an embedded microchannel cooling solution for such devices. By directly integrating micropillar arrays within the near-junction region of the
Jet-enhanced manifold microchannels for cooling
In this Article, we report an embedded microfluidic cooling strategy that is capable of dissipating heat fluxes up to 3,000 W cm −2 at a pumping power of
Uniform and Efficient Embedded Microfluidic Cooling for High-Power
To address this, an embedded microfluidic-cooled SiC power module is developed, combining embedded microchannels and nano-silver sintering to enable efficient and uniform cooling.
Advanced Cooling for Power Electronics
This paper discusses cooling technologies that have evolved to remove increasing levels of heat dissipation and manage junction temperatures to achieve goals for efficiency, cost, and
Self-cooling microchip provides a tiny solution to a giant problem
But a team of Swiss researchers believes they have a new solution by integrating cooling liquid directly into the chip itself. This approach could yield orders of magnitude improvements in...
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